Investigation of TSV Liner Interface With Multiwell Structured TSV to Suppress Noise Propagation in Mixed-Signal 3D-IC

Investigation of TSV Liner Interface With Multiwell Structured TSV to Suppress Noise Propagation in Mixed-Signal 3D-IC

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Mixed-signal 3D-ICs have a stacked structure of digital and analog circuit chips.In this study, the effect of noise propagation from a digital circuit on an analog circuit was evaluated using an click here actual mixed-signal 3D-IC.The noise propagation via through-silicon vias (TSVs) was measured, with a ring-oscillator 100w products as a noise source.For a comprehensive investigation, TSV-liner interface states were evaluated along the depth direction using unique multiwell-structured TSVs and a charge-pumping method.

It was considered that the interface traps and nonconformal thickness of the TSV liner increased the noise propagation among stacked chips.